Machine Features: 
1.Using UV laser.
2.Generating invisible conductive membrane.
3.Available for design change at any time with short importing time and high reliability.
4.Non-contact dry production with significantly fewer procedures compared with etching 

   and no need for subsequent cleaning and pollutant emission.
5.Minimum spacing between ultrastructure reaches 7μm, which greatly improves the utilization 

   rate of circuit board.
6.No need for template, direct molding with fast speed and low cost.
It employs laser with high beam quality, focuses on the conductive metal oxide or silver paste on 

glass, PMMA, PET, PE and other organic polymer, imports customer drawings through software 

and then directly processes the circuit as required.