1.High-performance CO2 laser with small focal spot and narrow kerf.
2.Clean processing with no dust when splitting to avoid circuit failure caused by the waste.
3.Directly splitting of assembled PCB with no contact nor stress.
4.High-accuracy two-axis working platform with high precision and fast speed.
5.Automatic CCD positioning and calibration.
6.Automatic computer software control and real-time feedback on the interface during processing to understand processing status at any time.
It is applied to precision cutting, shaping, windowing and uncovering of PCB, routing of packaged PCB and ordinary bare plate.
|Item ▼||Technical Parameters ▼|
|Machine Model||GD-PCBC 6050|
|Max. XY Platform Running Speed||30m/min|
|(The above parameters for reference only）|